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  2. Thermal paste - Wikipedia

    en.wikipedia.org/wiki/Thermal_paste

    Thermal paste (also called thermal compound, thermal grease, thermal interface material (TIM), thermal gel, heat paste, heat sink compound, heat sink paste or CPU grease) is a thermally conductive (but usually not electrically conductive) chemical compound, which is commonly used as an interface between heat sinks and heat sources such as high ...

  3. Computer cooling - Wikipedia

    en.wikipedia.org/wiki/Computer_cooling

    Thermal compound is commonly used to enhance the thermal conductivity from the CPU, GPU, or any heat-producing components to the heatsink cooler. (Counterclockwise from top left: Arctic MX-2, Arctic MX-4, Tuniq TX-4, Antec Formula 7, Noctua NT-H1).

  4. Heat sink - Wikipedia

    en.wikipedia.org/wiki/Heat_sink

    Thermal adhesive or thermal paste improve the heat sink's performance by filling air gaps between the heat sink and the heat spreader on the device. A heat sink is usually made out of a material with a high thermal conductivity , such as aluminium or copper.

  5. Best CPU Coolers 2022: AIO and Air Coolers

    www.aol.com/news/best-cpu-coolers-2022-aio...

    These are the best air and liquid/AIO CPU coolers for all consumer systems, from small form-factor builds to overclocked big rigs.

  6. Freezer (computer cooling) - Wikipedia

    en.wikipedia.org/wiki/Freezer_(computer_cooling)

    The Freezer is the name of the CPU coolers from Arctic GmbH, which has been the company's staple product for many years. [1] To most enthusiasts, Arctic is best known for their Freezer line of CPU coolers as well as their thermal compound called MX-2 and MX-4. [2]

  7. Thermal interface material - Wikipedia

    en.wikipedia.org/wiki/Thermal_interface_material

    A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).