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The MIL-STD-883 standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within military and aerospace electronic systems including basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations; mechanical and electrical tests; workmanship and ...
The HBM definition most widely used is the test model defined in the United States military standard, MIL-STD-883, Method 3015.9, Electrostatic Discharge Sensitivity Classification. This method establishes a simplified equivalent electrical circuit and the necessary test procedures required to model an HBM ESD event.
MIL-STD-883 methods 2011.9 destructive bond pull test [1] and 2031.1 flip chip pull off test [2] apply, as well as JEDEC JESD22-B109. Partial coring may be used, if necessary, to eliminate surface skin effects.
MIL-STD-810, test methods for determining the environmental effects on equipment [24] MIL-STD-882, standard practice for system safety [25] MIL-STD-883, test method standard for microcircuits [26] MIL-STD-1168, a classification system for ammunition production that replaced the Ammunition Identification Code (AIC) system used during World War II.
MIL-T-27730A (an obsolete military specification still commonly used in industry in the US) requires a minimum thickness of 3.5 mils and a minimum PTFE purity of 99%. [3] The second standard, A-A-58092, [ 4 ] is a commercial grade which maintains the thickness requirement of MIL-T-27730A and adds a minimum density of 1.2 g/cm 3 . [ 4 ]
According to method 2020.9 of MIL-STD-883 and method 2052.5 of MIL-STD-750, the purpose of a PIND test is to detect loose particles inside an electronics device cavity. The test provides a nondestructive means of identifying those devices containing particles of sufficient mass that, upon impact within the cavity, excite the transducer .