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  2. Fusion bonded epoxy coating - Wikipedia

    en.wikipedia.org/wiki/Fusion_bonded_epoxy_coating

    As the name indicates, in Fusion bonded epoxy coatings the resin part is an "epoxy" type resin. “Epoxy” or “Oxirane” structure contains a three membered cyclic ring — one oxygen atom connected to two carbon atoms – in the resin molecule. This part is the most reactive group in the epoxy resins.

  3. J-B Weld - Wikipedia

    en.wikipedia.org/wiki/J-B_Weld

    J-B Weld (stylized as J-B WELD) is the name of their flagship product: a specialized, high-temperature epoxy adhesive for use in bonding materials together. The company has run advertisements showing engine block repair with J-B Weld. [2] The J-B Weld Company, founded in 1969 by Sam Bonham in Sulphur Springs, Texas, specializes in epoxy products.

  4. Epoxy - Wikipedia

    en.wikipedia.org/wiki/Epoxy

    The largest volume type of circuit board—an "FR-4 board"—is a sandwich of layers of glass cloth bonded into a composite by an epoxy resin. Epoxy resins are used to bond copper foil to circuit board substrates, and are a component of the solder mask on many circuit boards. Flexible epoxy resins are used for potting transformers and inductors ...

  5. Direct bonding - Wikipedia

    en.wikipedia.org/wiki/Direct_bonding

    Direct bonding, or fusion bonding, is a wafer bonding process without any additional intermediate layers. It is based on chemical bonds between two surfaces of any material possible meeting numerous requirements. [ 1 ]

  6. Araldite - Wikipedia

    en.wikipedia.org/wiki/Araldite

    Araldite adhesive sets by the interaction of an epoxy resin with a hardener. Mixing an epoxy resin and hardener together starts a chemical reaction that produces heat – an exothermic reaction. [2] It is claimed that after curing the bond is impervious to boiling water and to all common organic solvents.

  7. Substrate (materials science) - Wikipedia

    en.wikipedia.org/wiki/Substrate_(materials_science)

    With all coating processes, the condition of the surface of the substrate can strongly affect the bond of subsequent layers. This can include cleanliness, smoothness, surface energy, moisture, etc. Coating can be by a variety of processes, including: Adhesives and adhesive tapes [2] Coating and printing processes