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Shallow trench isolation (STI), also known as box isolation technique, is an integrated circuit feature which prevents electric current leakage between adjacent semiconductor device components. STI is generally used on CMOS process technology nodes of 250 nanometers and smaller.
A deep channel 1 + 5 ⁄ 8 in × 2 + 7 ⁄ 16 in (41 mm × 62 mm) version is also manufactured. The material used to form the channel is typically sheet metal with a thickness of 1.5 mm or 2.5 mm (12 or 14 gauge; 0.1046 inch or 0.0747 inch, respectively). [2] Types of channel
The technology used a 32 nm SOI process, two CPU cores per module, and up to four modules, ranging from a quad-core design costing approximately US$130 to a $280 eight-core design. Ambarella Inc. announced the availability of the A7L system-on-a-chip circuit for digital still cameras, providing 1080p60 high-definition video capabilities in ...
The metric codes still represent the dimensions in mm, even though the imperial size codes are no longer aligned. Problematically, some manufacturers are developing metric 0201 components with dimensions of 0.25 mm × 0.125 mm (0.0098 in × 0.0049 in), [ 31 ] but the imperial 01005 name is already being used for the 0.4 mm × 0.2 mm (0.0157 in ...
The structural channel is not used as much in construction as symmetrical beams, in part because its bending axis is not centered on the width of the flanges. If a load is applied equally across its top, the beam will tend to twist away from the web. This may not be a weak point or problem for a particular design, but is a factor to be ...
Some measurements of modules are size, width, speed, and latency. A memory module consists of a multiple of the memory chips to equal the desired module width. So a 32-bit SIMM module could be composed of four 8-bit wide (×8) chips. As noted in the memory channel part, one physical module can be made up of one or more logical ranks.
Requires a carrier board. Typically used for COM-HPC Client Type modules with multiple SODIMM memory sockets. COM-HPC Size D PICMG: 2020 160 × 160 mm (6.3 × 6.3 in) Used in embedded systems. Requires a carrier board. Typically used for COM-HPC Server Type modules with 4x full size DIMM memory sockets. COM-HPC Size E PICMG: 2020 200 × 160 mm
The FMC specification has two defined sizes: single width (69 mm) and double width (139 mm). The depth of both is about 76.5 mm. [4] The FMC mezzanine module uses a high-pin count 400 pin high-speed array connector. A mechanically compatible low pin count connector with 160 pins can also be used with any of the form factors in the standard.