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  2. LGA 1700 - Wikipedia

    en.wikipedia.org/wiki/LGA_1700

    Compared to its predecessor, it has 500 more pins, which required a major change in socket and processor sizes; it is 7.5 mm longer. It is the first major change in Intel's LGA desktop CPU socket size since the introduction of LGA 775 in 2004, especially for consumer-grade CPU sockets. The larger size also required a change in the heatsink ...

  3. Motherboard form factor - Wikipedia

    en.wikipedia.org/wiki/Motherboard_form_factor

    305 × 244 mm (12 × 9.6 in) Created by Intel in 1995. As of 2017, it is the most popular form factor for commodity motherboards. Typical size is 9.6 × 12 in although some companies extend that to 10 × 12 in. SSI CEB: SSI? 305 × 267 mm (12 × 10.5 in) Created by the Server System Infrastructure (SSI) forum. Derived from the EEB and ATX ...

  4. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    The codes given in the chart below usually tell the length and width of the components in tenths of millimeters or hundredths of inches. For example, a metric 2520 component is 2.5 mm by 2.0 mm which corresponds roughly to 0.10 inches by 0.08 inches (hence, imperial size is 1008).

  5. DTX (form factor) - Wikipedia

    en.wikipedia.org/wiki/DTX_(form_factor)

    The DTX form factor is a variation of ATX specification [1] designed especially for small form factor PCs (especially for HTPCs) with dimensions of 8 × 9.6 inches (203 × 244 mm). [2] An industry standard intended to enable interchangeability for systems similar to Shuttle's original "SFF" designs, [3] AMD announced its development on January ...

  6. LGA 1156 - Wikipedia

    en.wikipedia.org/wiki/LGA_1156

    LGA 1156 (land grid array 1156), also known as Socket H [2] [3] or H1, is an Intel desktop CPU socket.The last processors supporting the LGA 1156 ceased production in 2011. It was succeeded by the mutually incompatible socket LGA 1155.

  7. List of semiconductor scale examples - Wikipedia

    en.wikipedia.org/wiki/List_of_semiconductor...

    IBM Waternoose Xbox 360 Processor – 2005; IBM–Sony–Toshiba Cell processor – 2005; Intel Pentium 4 Prescott – 2004-02; Intel Celeron D Prescott-256 – 2004-05; Intel Pentium M Dothan – 2004-05; Intel Celeron M Dothan-1024 – 2004-08; Intel Xeon Nocona, Irwindale, Cranford, Potomac, Paxville – 2004-06; Intel Pentium D Smithfield ...

  8. PlayStation 3 technical specifications - Wikipedia

    en.wikipedia.org/wiki/PlayStation_3_technical...

    The power consumption of the initial PlayStation 3 units, based on 90 nm Cell CPU, ranges from 170–200 W during normal use, despite having a 380 W power supply. [ 33 ] The power consumption of newer 40 GB PlayStation 3 units (65 nm process Cell/90 nm RSX), ranges from 120-140 W during normal use.

  9. LGA 1150 - Wikipedia

    en.wikipedia.org/wiki/LGA_1150

    LGA 1150, [1] also known as Socket H3, is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by Intel for CPUs built on the Haswell microarchitecture. This socket is also used by the Haswell's successor, Broadwell microarchitecture.