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Ultrasonic soldering (U/S soldering) is a flux-less soldering process that uses ultrasonic energy, without the need for chemicals to solder materials, such as glass, ceramics, and composites, hard to solder metals and other sensitive components which cannot be soldered using conventional means.
An improperly selected or applied flux can cause joint failure. Without flux the joint may not be clean, or may be oxidized, resulting in an unsound joint. For electronic work, flux-core solder wire is generally used, but additional flux may be used from a flux pen or dispensed from a small bottle with a syringe-like needle.
Rosin used as flux for soldering A flux pen used for electronics rework Multicore solder containing flux Wire freshly coated with solder, held above molten rosin flux. In metallurgy, a flux is a chemical reducing agent, flowing agent, or purifying agent. Fluxes may have more than one function at a time.
Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder.It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [1] as it is near eutectic, with adequate thermal fatigue properties, strength, and wettability. [2]
The amount of time solder paste can stay on a stencil without affecting its printing properties. The paste manufacturer provides this value. Tack Tack is the property of a solder paste to hold a component after the component had been placed by the placement machine. Hence, tack life is the critical property of solder pastes.
After fabrication of the BGA package, tiny balls of solder are glued to the pads on its underside; during assembly the balled package is placed on the PCB and heated to melt the solder and, all being well, to connect each pad on the device to its mate on the PCB without any extraneous solder bridging between adjacent pads. Bad connections ...
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Soldering copper pipes using a propane torch and a lead-free solder. Solder is a metallic material that is used to connect metal workpieces. The choice of specific solder alloys depends on their melting point, chemical reactivity, mechanical properties, toxicity, and other properties. Hence a wide range of solder alloys exist, and only major ...