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Doping of a pure silicon array. Silicon based intrinsic semiconductor becomes extrinsic when impurities such as boron and antimony are introduced.. In semiconductor production, doping is the intentional introduction of impurities into an intrinsic (undoped) semiconductor for the purpose of modulating its electrical, optical and structural properties.
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While there is considerable scatter in the experimental data, for noncompensated material (no counter doping) for heavily doped substrates (i.e. and up), the mobility in silicon is often characterized by the empirical relationship: [37] = + + where N is the doping concentration (either N D or N A), and N ref and α are fitting parameters.
Doping greatly increases the number of charge carriers within the crystal. When a semiconductor is doped by Group V elements, they will behave like donors creating free electrons, known as "n-type" doping. When a semiconductor is doped by Group III elements, they will behave like acceptors creating free holes, known as "p-type" doping. The ...
A pulsed laser is directed at the silicon wafer and this results in localised melting and subsequent recrystallisation of the silicon wafer material, allowing boron atoms in the gas to diffuse into the molten sections of the silicon wafer. [1] The result of this process is a silicon wafer with boron impurities, creating a P-type semiconductor.
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An extrinsic semiconductor is one that has been doped; during manufacture of the semiconductor crystal a trace element or chemical called a doping agent has been incorporated chemically into the crystal, for the purpose of giving it different electrical properties than the pure semiconductor crystal, which is called an intrinsic semiconductor.
Silicon wafers are generally not 100% pure silicon, but are instead formed with an initial impurity doping concentration between 10 13 and 10 16 atoms per cm 3 of boron, phosphorus, arsenic, or antimony which is added to the melt and defines the wafer as either bulk n-type or p-type. [27]