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4 layer Wallace reduction of an 8x8 partial product matrix, using 15 half adders (two dots) and 38 full adders (three dots). The dots in each column are bits of equal weight. A Wallace multiplier is a hardware implementation of a binary multiplier, a digital circuit that multiplies two integers.
Minimum message length (MML) is a Bayesian information-theoretic method for statistical model comparison and selection. [1] It provides a formal information theory restatement of Occam's Razor: even when models are equal in their measure of fit-accuracy to the observed data, the one generating the most concise explanation of data is more likely to be correct (where the explanation consists of ...
Unlike Wallace multipliers that reduce as much as possible on each layer, Dadda multipliers attempt to minimize the number of gates used, as well as input/output delay. Because of this, Dadda multipliers have a less expensive reduction phase, but the final numbers may be a few bits longer, thus requiring slightly bigger adders.
the Mechanical threshold stress model. the Preston–Tonks–Wallace model. The Johnson–Cook (JC) model [24] is purely empirical and is the most widely used of the five. However, this model exhibits an unrealistically small strain-rate dependence at high temperatures. The Steinberg–Cochran–Guinan–Lund (SCGL) model [25] [26] is semi ...
Layers of protection analysis (LOPA) is a technique for evaluating the hazards, risks and layers of protection associated with a system, such as a chemical process plant. . In terms of complexity and rigour LOPA lies between qualitative techniques such as hazard and operability studies (HAZOP) and quantitative techniques such as fault trees and event trees.
Model order reduction also finds modern applications in aeronautics to model the flow over the body of aircraft. [29] An example can be found in Lieu et al [ 30 ] in which the full order model of an F16 fighter-aircraft with over 2.1 million degrees of freedom, was reduced to a model of just 90 degrees of freedom.
There are several methods for 3D IC design, including recrystallization and wafer bonding methods. There are two major types of wafer bonding, Cu-Cu connections (copper-to-copper connections between stacked ICs, used in TSVs) [18] [19] and through-silicon via (TSV). 3D ICs with TSVs may use solder microbumps, small solder balls as an interface between two individual dies in a 3D IC. [20]
The model has two guiding principles: [4] The position basis states are used in the dynamic state reduction (the "preferred basis" is position); The modification must reduce superpositions for macroscopic objects without altering the microscopic predictions.