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Direct bonding, or fusion bonding, is a wafer bonding process without any additional intermediate layers. It is based on chemical bonds between two surfaces of any material possible meeting numerous requirements. [1] These requirements are specified for the wafer surface as sufficiently clean, flat and smooth.
If too much air becomes trapped in the concrete as a result of the mixing process, defoamers can be used to encourage the air bubble to agglomerate, rise to the surface of the wet concrete and then disperse. Bonding agents are used to create a bond between old and new concrete (typically a type of polymer) with wide temperature tolerance and ...
The derivation of the maximum arching moment of resistance of laterally restrained concrete bridge deck slabs utilised Rankin's [21] idealised elastic-plastic stress-strain criterion for concrete, valid for concrete cylinder strengths up to at least 70N/mm 2, which he had derived on the basis of Hognestad, Hanson and McHenry's [23] ultimate ...
Plasma-activated bonding is a derivative, directed to lower processing temperatures for direct bonding with hydrophilic surfaces. The main requirements for lowering temperatures of direct bonding are the use of materials melting at low temperatures and with different coefficients of thermal expansion (CTE) .
In this case, concrete base material might be undamaged. Pull-out: the anchor is pulled out from the drilled hole partially damaging the surrounding concrete. When the concrete is damaged the failure is also indicated as pull-through. Concrete cone: after reaching the load-bearing capacity a cone shape is formed.
Modern dental bonding systems come as a “three-step system”, where the etchant, primer, and adhesive are applied sequentially; as a “two-step system”, where the etchant and the primer are combined for simultaneous application; and as a “one-step system”, where all the components should be premixed and applied in a single application ...
The alkali–silica reaction (ASR), also commonly known as concrete cancer, [3] is a deleterious internal swelling reaction that occurs over time in concrete between the highly alkaline cement paste and the reactive amorphous (i.e., non-crystalline) silica found in many common aggregates, given sufficient moisture.
Adhesive bonding has the advantage of relatively low bonding temperature as well as the absence of electric voltage and current. Based on the fact that the wafers are not in direct contact, this procedure enables the use of different substrates, e.g. silicon, glass, metals and other semiconductor materials.