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Epoxy is the family of basic components or cured end products of epoxy resins. Epoxy resins, also known as polyepoxides, are a class of reactive prepolymers and polymers which contain epoxide groups. The epoxide functional group is also collectively called epoxy. [1] The IUPAC name for an epoxide group is an oxirane.
Epoxy resins can be categorized into three distinct types based on the chemical structure of their resin backbone: aliphatic, cycloaliphatic, and aromatic epoxy resins. [4] An increase in the molecular length between reactive epoxy groups results in a reduction of crosslink density and resin modulus, while simultaneously enhancing the failure ...
Araldite adhesive sets by the interaction of an epoxy resin with a hardener. Mixing an epoxy resin and hardener together starts a chemical reaction that produces heat – an exothermic reaction. [2] It is claimed that after curing the bond is impervious to boiling water and to all common organic solvents.
After evaporation of the solvent, a solid compound is formed. Chemical bonds are also important in certain adhesive / substrate combinations, for example when bonding glass using silicone adhesives, wood using polyurethane adhesives and aluminium using epoxy adhesives. Chemical bonding leads to significantly higher adhesion than physical bonding.
It is a precursor in the production of epoxy resins. [19] Halohydrins react with base to give epoxides. [20] The reaction is spontaneous because the energetic cost of introducing the ring strain (13 kcal/mol) is offset by the larger bond enthalpy of the newly introduced C-O bond (when compared to that of the cleaved C-halogen bond).
A small transformer potted in epoxy. The surface visible on the right is formed by the potting compound that has been poured into the plastic box. In electronics, potting is the process of filling a complete electronic assembly with a solid or gelatinous compound.
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Certain epoxy resins and their processes can create a hermetic bond to copper, brass, stainless steel, specialty alloys, plastic, or epoxy itself with similar coefficients of thermal expansion, and are used in the manufacture of hermetic electrical and fiber optic hermetic seals. Epoxy-based seals can increase signal density within a ...