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Dynamic frequency scaling (also known as CPU throttling) is a power management technique in computer architecture whereby the frequency of a microprocessor can be automatically adjusted "on the fly" depending on the actual needs, to conserve power and reduce the amount of heat generated by the chip.
Thermal Monitor 2 (TM2) is a throttling control method used on LGA 775 versions of the Core 2, Pentium Dual-Core, Pentium D, Pentium 4 and Celeron processors and also on the Pentium M series of processors. [1] TM2 reduces processor temperature by lowering the CPU clock multiplier, and thereby the processor core speed. [2]
Here they also inform that starting from the 12th generation of their CPUs the term Thermal Design Power (TDP) has been replaced with Processor Base Power (PBP). [28] In a support page dedicated to the Core i7 -7700 processor, Intel defines the TDP as the maximum amount of heat that a processor can produce when running real life applications ...
This is generally known as Thermal Throttling in the case of reduction of clock speeds, or Thermal Shutdown in the case of a complete shutdown of the device or system. Cooling may be designed to reduce the ambient temperature within the case of a computer, such as by exhausting hot air, or to cool a single component or small area (spot cooling).
Profiles include algorithm, microarchitecture, parallelism, I/O, system, thermal throttling, and accelerators (GPU and FPGA). [citation needed] Local, Remote, Server VTune supports local and remote performance profiling.
Every time the temperature sensing network determines that a rise above the specified junction temperature (), is imminent, measures such as clock gating, clock stretching, clock speed reduction and others (commonly referred to as thermal throttling) are applied to prevent the temperature to raise further. If the applied mechanisms are not ...
An Intel November 2008 white paper [10] discusses "Turbo Boost" technology as a new feature incorporated into Nehalem-based processors released in the same month. [11]A similar feature called Intel Dynamic Acceleration (IDA) was first available with Core 2 Duo, which was based on the Santa Rosa platform and was released on May 10, 2007.
Therefore, thermal insulation profiles are used to create a thermal separation of the inner and outer shells of metal frames. The variety of thermal insulation profiles (Insulbar) allows low U f values (for example 1.3 W/m 2 K by using a 34mm insulation profile and up to 1.1 W/m 2 K with contemporary aluminum systems) to be reached.