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  2. HMG Heat and Waterproof Adhesive - Wikipedia

    en.wikipedia.org/wiki/HMG_Heat_and_Waterproof...

    HMG Heat and Waterproof Adhesive (also known as HMG or HMG adhesive) is a brand of cellulose nitrate adhesive manufactured by H Marcel Guest Ltd. It is one of the most popular cellulose nitrate adhesives used in conservation and restoration work, and is used on materials such as metal, wood, glass, and pottery.

  3. Space Shuttle thermal protection system - Wikipedia

    en.wikipedia.org/wiki/Space_Shuttle_thermal...

    The key to a reusable shield against this type of heating is very low-density material, similar to how a thermos bottle inhibits convective heat transfer. [ citation needed ] Some high-temperature metal alloys can withstand reentry heat; they simply get hot and re-radiate the absorbed heat.

  4. Heat shield - Wikipedia

    en.wikipedia.org/wiki/Heat_shield

    An example of a steel heat shield on a BMW E series engine Rigid heat shields have until recently commonly been made from solid steel, [6] but are now often made from aluminum. Some high-end rigid heat shields are made out of either aluminum, gold or composite, with most examples including a ceramic coating to provide a thermal barrier , which ...

  5. Thermal paste - Wikipedia

    en.wikipedia.org/wiki/Thermal_paste

    Thermal paste (also called thermal compound, thermal grease, thermal interface material (TIM), thermal gel, heat paste, heat sink compound, heat sink paste or CPU grease) is a thermally conductive (but usually not electrically conductive) chemical compound, which is commonly used as an interface between heat sinks and heat sources such as high ...

  6. The 10 Best Glass-Top Stove Cleaners for a Shiny ... - AOL

    www.aol.com/lifestyle/10-best-glass-top-stove...

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  7. Thermal adhesive - Wikipedia

    en.wikipedia.org/wiki/Thermal_adhesive

    Thermal adhesive is a type of thermally conductive glue used for electronic components and heat sinks. It can be available as a paste (similar to thermal paste) or as a double-sided tape. [1] It is commonly used to bond integrated circuits to heatsinks where there are no other mounting mechanisms available.