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  2. Comparison of Intel processors - Wikipedia

    en.wikipedia.org/wiki/Comparison_of_Intel_processors

    Some Xeon Phi processors support four-way hyper-threading, effectively quadrupling the number of threads. [1] Before the Coffee Lake architecture, most Xeon and all desktop and mobile Core i3 and i7 supported hyper-threading while only dual-core mobile i5's supported it.

  3. Zen 5 - Wikipedia

    en.wikipedia.org/wiki/Zen_5

    Two AMD Ryzen 9000 series microprocessors with Zen 5 architecture. Zen 5 is the name for a CPU microarchitecture by AMD, shown on their roadmap in May 2022, [3] launched for mobile in July 2024 and for desktop in August 2024. [4]

  4. i486 - Wikipedia

    en.wikipedia.org/wiki/I486

    New computers equipped with 486 processors in discount warehouses became scarce, and an IBM spokesperson called it a "dinosaur". [13] Even after the Pentium series of processors gained a foothold in the market, however, Intel continued to produce 486 cores for industrial embedded applications.

  5. AMD - Wikipedia

    en.wikipedia.org/wiki/AMD

    AMD's new platform, codenamed "Dragon", used the new Phenom II processor, and an ATI R770 GPU from the R700 GPU family, and a 790 GX/FX chipset from the AMD 700 chipset series. [130] The Phenom II came in dual-core, triple-core and quad-core variants, all using the same die, with cores disabled for the triple-core and dual-core versions.

  6. List of computer hardware manufacturers - Wikipedia

    en.wikipedia.org/wiki/List_of_computer_hardware...

    Arm Ltd. (sells designs only) Amazon (AWS Graviton is ARM-based); Apple Inc. (ARM-based CPUs) Broadcom Inc. (ARM-based, e.g. for Raspberry Pi) Fujitsu (its ARM-based CPU used in top supercomputer, still also sells its SPARC-based servers)

  7. Raptor Lake - Wikipedia

    en.wikipedia.org/wiki/Raptor_Lake

    The processors are connected to PCHs using an OPIO 2.0 x8 interface, except for the HX series which uses a DMI 4.0 x8 interface. [29] Except for the HX series, the processor and PCH are packaged together on a multi-chip package. The HX series uses 45x37.5mm BGA 1964, and the other mobile processors use 25x50mm BGA 1744, on a Type 3 or Type 4 HDI.