Search results
Results From The WOW.Com Content Network
Similar to design for manufacture (DFM) and design for assembly (DFA) (which seek to avoid designs which are difficult to make), the concept of DFI considers measurement capabilities at an early stage in the product development life cycle and uses knowledge of the fundamental principles of metrology to achieve cost reduction. If the inspection ...
Computer-aided inspection (CAI) is the use of software tools to assess manufactured objects. [ 1 ] [ 2 ] It is closely related to computer-aided design (CAD) and computer-aided manufacturing (CAM). Its primary purpose is to allow engineers to more quickly and precisely assess the physical properties of manufactured objects.
In scan-design, registers (flip-flops or latches) in the design are connected in one or more scan chains, which are used to gain access to internal nodes of the chip. Test patterns are shifted in via the scan chain(s), functional clock signals are pulsed to test the circuit during the "capture cycle(s)", and the results are then shifted out to ...
These topics must be completed before the production is started. They include the following aspects: design robustness, design testing, and specification compliance, production process design, quality inspection standards, process capability, production capacity, product packaging, product testing, and operator training plan. APQP focuses on:
This gives rise to the terms design for manufacturability (DfM, DFM), design for inspection (DFI), design for variability (DfV), design for cost (DfC). Similarly, other disciplines may associate other traits, attributes, or objectives for X. Under the label design for X, a wide set of specific design guidelines are summarized. Each design ...
Inspection is a major component of quality control, where physical product is examined visually (or the end results of a service are analyzed). Product inspectors will be provided with lists and descriptions of unacceptable product defects such as cracks or surface blemishes for example.
Inspection and measurement of the thickness of the different layers of an electronic chip using THz and X-ray radiation. THz has the privilege of being non-ionizing (non-destructive) but the resolution of X-ray is higher. [2] Quality related in-process inspection/verification is an essential part of quality control in manufacturing.
Environmental stress screening (ESS) refers to the process of exposing a newly manufactured or repaired product or component (typically electronic) to stresses such as thermal cycling and vibration in order to force latent defects to manifest themselves by permanent or catastrophic failure during the screening process.