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The MIL-STD-883 standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within military and aerospace electronic systems including basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations; mechanical and electrical tests; workmanship and ...
The HBM definition most widely used is the test model defined in the United States military standard, MIL-STD-883, Method 3015.9, Electrostatic Discharge Sensitivity Classification. This method establishes a simplified equivalent electrical circuit and the necessary test procedures required to model an HBM ESD event.
"mil-std-781d, military standard, reliability testing for engineering development, qualification, and production (s/s by mil-hdbk-781a)" (pdf). united states department of defense. 17 oct 1986. "mil-std-810g, department of defense test method standard, environmental engineering considerations and laboratory tests" (pdf).
MIL-STD-883 methods 2011.9 destructive bond pull test [1] and 2031.1 flip chip pull off test [2] apply, as well as JEDEC JESD22-B109. Partial coring may be used, if necessary, to eliminate surface skin effects.
MIL-STD-810, test methods for determining the environmental effects on equipment [24] MIL-STD-882, standard practice for system safety [25] MIL-STD-883, test method standard for microcircuits [26] MIL-STD-1168, a classification system for ammunition production that replaced the Ammunition Identification Code (AIC) system used during World War II.
The test procedures of these requirements are found in MIL-STD-883 (Test Methods and Procedures for Microelectronics) as a listing of test methods. These methods cover various aspects of the minimum requirements that a microelectronics device must be able to attain before it is considered a compliant device.