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  2. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    Problematically, some manufacturers are developing metric 0201 components with dimensions of 0.25 mm × 0.125 mm (0.0098 in × 0.0049 in), [31] but the imperial 01005 name is already being used for the 0.4 mm × 0.2 mm (0.0157 in × 0.0079 in) package. These increasingly small sizes, especially 0201 and 01005, can sometimes be a challenge from ...

  3. Pin grid array - Wikipedia

    en.wikipedia.org/wiki/Pin_grid_array

    In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the package. The pins are commonly spaced 2.54 mm (0.1") apart, [1] and may or may not cover the entire underside of the package. PGAs are often mounted on printed circuit boards using the through hole method or inserted into a socket.

  4. Thin small outline package - Wikipedia

    en.wikipedia.org/wiki/Thin_small_outline_package

    The table below shows basic measurements for common TSOP packages. [3] Type I. Part number Pins Body width (mm) Body length (mm) Lead pitch (mm) TSOP28 28 8.1 11.8 0. ...

  5. Small outline integrated circuit - Wikipedia

    en.wikipedia.org/wiki/Small_Outline_Integrated...

    MS-012 PLASTIC DUAL SMALL OUTLINE GULL WING, 1.27 MM PITCH PACKAGE, 3.9 MM BODY WIDTH. MS-013 VERY THICK PROFILE, PLASTIC SMALL OUTLINE FAMILY, 1.27 MM PITCH, 7.50 MM BODY WIDTH. JEITA (previously EIAJ, which term some vendors still use): Semiconductor Device Packages. (EIAJ Type II is 5.3 mm body width, and slightly thicker and longer than ...

  6. 2 nm process - Wikipedia

    en.wikipedia.org/wiki/2_nm_process

    In semiconductor manufacturing, the 2 nm process is the next MOSFET (metal–oxide–semiconductor field-effect transistor) die shrink after the 3 nm process node.. The term "2 nanometer", or alternatively "20 angstrom" (a term used by Intel), has no relation to any actual physical feature (such as gate length, metal pitch or gate pitch) of the transistors.

  7. TO-5 - Wikipedia

    en.wikipedia.org/wiki/TO-5

    The tab is located 45° from pin 1, which is typically the emitter. The typical TO-5 package has a base diameter of 8.9 mm (0.35 in), a cap diameter of 8.1 mm (0.32 in), a cap height of 6.3 mm (0.25 in). [1] The pins are isolated from the package by individual glass-metal seals, or by a single resin potting.

  8. Orders of magnitude (length) - Wikipedia

    en.wikipedia.org/wiki/Orders_of_magnitude_(length)

    1.5 mmaverage length of a flea [27] 2.54 mm – distance between pins on old dual in-line package (DIP) electronic components; 5 mmlength of an average red ant; 5 mm – diameter of an average grain of rice; 5.56×45mm NATO – standard ammunition size; 6 mm – approximate width of a pencil

  9. Rack unit - Wikipedia

    en.wikipedia.org/wiki/Rack_unit

    Rack with sample component sizes including an A/V half-rack unit. A rack unit (abbreviated U or RU) is a unit of measure defined as 1 + 3 ⁄ 4 inches (44.45 mm). [1] [2] It is most frequently used as a measurement of the overall height of 19-inch and 23-inch rack frames, as well as the height of equipment that mounts in these frames, whereby the height of the frame or equipment is expressed ...