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A thermocouple, also known as a "thermoelectrical thermometer", is an electrical device consisting of two dissimilar electrical conductors forming an electrical junction.A thermocouple produces a temperature-dependent voltage as a result of the Seebeck effect, and this voltage can be interpreted to measure temperature.
An FMEDA can predict failure rates per defined failure modes. For Functional Safety applications the IEC 61508 failure modes (safe, dangerous, annunciation, and no effect) are used. These failure rate numbers can be converted into the alternative failure modes from the automotive functional safety standard, ISO 26262.
Failure mode and effects analysis (FMEA; often written with "failure modes" in plural) is the process of reviewing as many components, assemblies, and subsystems as possible to identify potential failure modes in a system and their causes and effects. For each component, the failure modes and their resulting effects on the rest of the system ...
The failure mode may then be charted on a criticality matrix using severity code as one axis and probability level code as the other. For quantitative assessment, modal criticality number is calculated for each failure mode of each item, and item criticality number is calculated for each item. The criticality numbers are computed using the ...
The best place to start is with the failure mode. This is based on the assumption that there is a particular failure mode, or range of modes, that may occur within a product. It is therefore reasonable to assume that the bond test should replicate the mode, or modes of interest. However, exact replication is not always possible.
The IC is usually monitored under stress and tested at intermediate intervals. This reliability stress test is sometimes referred to as a lifetime test, device life test or extended burn in test and is used to trigger potential failure modes and assess IC lifetime. There are several types of HTOL:
Accelerated life testing is the process of testing a product by subjecting it to conditions (stress, strain, temperatures, voltage, vibration rate, pressure etc.) in excess of its normal service parameters in an effort to uncover faults and potential modes of failure in a short amount of time.
Often by the time the failure rate data are available, the devices under study have become obsolete. Due to this drawback, failure-rate prediction methods have been developed. These methods may be used on newly designed devices to predict the device's failure rates and failure modes. Two approaches have become well known, Cycle Testing and FMEDA.