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The mixture with less wt.% of copper has higher density, higher hardness, and higher resistivity. The typical density of CuW90, with 10% of copper, is 16.75 g/cm 3 and 11.85 g/cm 3 for CuW50 . CuW90 has higher hardness and resistivity of 260 HB kgf/mm 2 and 6.5 μΩ.cm than CuW50. Typical properties of commonly used copper tungsten compositions [1]
Electrochemical machining, as a technological method, originated from the process of electrolytic polishing offered already in 1911 by a Russian chemist E. Shpitalsky. [3] As far back as 1929, an experimental ECM process was developed by W.Gussef, although it was 1959 before a commercial process was established by the Anocut Engineering Company.
Electrical discharge machining is a machining method primarily used for hard metals or those that would be very difficult to machine with traditional techniques. EDM typically works with materials that are electrically conductive, although methods have also been proposed for using EDM to machine insulating ceramics.
Electrochemical grinding is often used for hard materials where conventional machining is difficult and time-consuming, such as stainless steel and some exotic metals. For materials with hardness greater than 65 HRC, ECG can have a material removal rate 10 times that of conventional machining.
For the production of the tungsten heavy alloy, binder mixtures of nickel and iron or nickel and copper are widely used. The tungsten content of the alloy is normally above 90%. The diffusion of the binder elements into the tungsten grains is low even at the sintering temperatures and therefore the interior of the grains are pure tungsten. [18]
Since that time, the integrated circuit industry has moved from aluminum to copper conductors. This required the development of an additive patterning process, which relies on the unique abilities of CMP to remove material in a planar and uniform fashion and to stop repeatably at the interface between copper and oxide insulating layers (see ...
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