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  2. Furnace anneal - Wikipedia

    en.wikipedia.org/wiki/Furnace_anneal

    Furnace annealing is a process used in semiconductor device fabrication which consist of heating multiple semiconductor wafers in order to affect their electrical properties. Heat treatments are designed for different effects.

  3. Semiconductor device fabrication - Wikipedia

    en.wikipedia.org/wiki/Semiconductor_device...

    Semiconductor device fabrication is the process ... Companies that manufacture machines used in the industrial semiconductor ... Annealing was initially done at 500 ...

  4. Rapid thermal processing - Wikipedia

    en.wikipedia.org/wiki/Rapid_thermal_processing

    Rapid thermal processing (RTP) is a semiconductor manufacturing process which heats silicon wafers to temperatures exceeding 1,000°C for not more than a few seconds. During cooling wafer temperatures must be brought down slowly to prevent dislocations and wafer breakage due to thermal shock.

  5. Factbox-US targets China's chip industry with new restrictions

    www.aol.com/news/factbox-us-targets-chinas-chip...

    New controls will be placed on semiconductor manufacturing equipment needed to produce advanced-node integrated circuits, including certain etch, deposition, lithography ... annealing, metrology ...

  6. Ultra-high-purity steam for oxidation and annealing - Wikipedia

    en.wikipedia.org/wiki/Ultra-high-purity_steam...

    Annealing and passivation are techniques used to repair atomic defects within the crystal that propagate into the wafer macrostructure, reducing efficiencies in microelectronics and photovoltaic cells. High temperature annealing can increase carrier lifetimes by injecting H into the Si/SiO 2 interface.

  7. Front end of line - Wikipedia

    en.wikipedia.org/wiki/Front_end_of_line

    Illustration of FEOL (device generation in the silicon, bottom) and BEOL (depositing metalization layers, middle part) to connect the devices. CMOS fabrication process. The front end of line (FEOL) is the first portion of IC fabrication where the individual components (transistors, capacitors, resistors, etc.) are patterned in a semiconductor substrate. [1]