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  2. Water block - Wikipedia

    en.wikipedia.org/wiki/Water_block

    A water block is the watercooling equivalent of a heatsink. It is a type of plate heat exchanger and can be used on many different computer components, [1]: 186 including the central processing unit (CPU), GPU, PPU, and northbridge chipset on the motherboard. There are also Monoblocks on the market that are mounted on PC motherboards and cover ...

  3. Computer cooling - Wikipedia

    en.wikipedia.org/wiki/Computer_cooling

    Liquid cooling is typically combined with air cooling, using liquid cooling for the hottest components, such as CPUs or GPUs, while retaining the simpler and cheaper air cooling for less demanding components. The IBM Aquasar system uses hot water cooling to achieve energy efficiency, the water being used to heat buildings as well. [40] [41]

  4. EKWB - Wikipedia

    en.wikipedia.org/wiki/EKWB

    EKWB (Edvard König Water Blocks), better known as EK Water Blocks, is a Slovenian company founded in 2003 that manufactures high-end computer water cooling, extreme cooling, and some air cooling components for CPUs, GPU, RAM, and SSDs. [1]

  5. List of Intel Core processors - Wikipedia

    en.wikipedia.org/wiki/List_of_Intel_Core_processors

    The latest badge promoting the Intel Core branding. The following is a list of Intel Core processors.This includes Intel's original Core (Solo/Duo) mobile series based on the Enhanced Pentium M microarchitecture, as well as its Core 2- (Solo/Duo/Quad/Extreme), Core i3-, Core i5-, Core i7-, Core i9-, Core M- (m3/m5/m7/m9), Core 3-, Core 5-, and Core 7- Core 9-, branded processors.

  6. Liquid cooling - Wikipedia

    en.wikipedia.org/wiki/Liquid_cooling

    In computing and electronics, liquid cooling involves the technology that uses a special water block to conduct heat away from the processor as well as the chipset. [1] This method can also be used in combination with other traditional cooling methods such as those that use air. The application to microelectronics is either indirect or direct.

  7. Thermal design power - Wikipedia

    en.wikipedia.org/wiki/Thermal_design_power

    Thermal Design Power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component (like a CPU, GPU or system on a chip) can generate and that its cooling system is designed to dissipate during normal operation at a non-turbo clock rate (base frequency).