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Ultrasonic soldering (U/S soldering) is a flux-less soldering process that uses ultrasonic energy, without the need for chemicals to solder materials, such as glass, ceramics, and composites, hard to solder metals and other sensitive components which cannot be soldered using conventional means.
An improperly selected or applied flux can cause joint failure. Without flux the joint may not be clean, or may be oxidized, resulting in an unsound joint. For electronic work, flux-core solder wire is generally used, but additional flux may be used from a flux pen or dispensed from a small bottle with a syringe-like needle.
Selective soldering machine. Selective soldering is the process of selectively soldering components to printed circuit boards and molded modules that could be damaged by the heat of a reflow oven or wave soldering in a traditional surface-mount technology (SMT) or through-hole technology assembly processes. This usually follows an SMT oven ...
Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach anywhere from one to thousands of tiny electrical components to their contact pads, after which the entire assembly is subjected to controlled heat. The solder paste reflows in a molten state, creating permanent ...
Dip soldering is a small-scale soldering process by which electronic components are soldered to a printed circuit board (PCB) to form an electronic assembly. The solder wets to the exposed metallic areas of the board (those not protected with solder mask ), creating a mechanical and electrical connection.
The use of flux or self-fluxing material is required to prevent oxidation. Torch brazing of copper can be done without the use of flux if it is brazed with a torch using oxygen and hydrogen gas, rather than oxygen and other flammable gases. Machine torch brazing is commonly used