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Ultrasonic soldering (U/S soldering) is a flux-less soldering process that uses ultrasonic energy, without the need for chemicals to solder materials, such as glass, ceramics, and composites, hard to solder metals and other sensitive components which cannot be soldered using conventional means.
An improperly selected or applied flux can cause joint failure. Without flux the joint may not be clean, or may be oxidized, resulting in an unsound joint. For electronic work, flux-core solder wire is generally used, but additional flux may be used from a flux pen or dispensed from a small bottle with a syringe-like needle.
Dip soldering apparatus. Dip soldering is a small-scale soldering process by which electronic components are soldered to a printed circuit board (PCB) to form an electronic assembly. The solder wets to the exposed metallic areas of the board (those not protected with solder mask), creating a mechanical and electrical connection.
Both quantitative and qualitative tests for solderability exist. [6] The two most common testing methods are the 'dip and look' method and wetting balance analysis.In both of these tests, the soldered pieces undergo an accelerated aging process before being tested for solderability, to take into consideration the time a component was in storage prior to mounting to final assembly.
Selective soldering machine. Selective soldering is the process of selectively soldering components to printed circuit boards and molded modules that could be damaged by the heat of a reflow oven or wave soldering in a traditional surface-mount technology (SMT) or through-hole technology assembly processes. This usually follows an SMT oven ...
The flux also serves the purpose of cleaning any contamination left on the brazing surfaces. Flux can be applied in any number of forms including flux paste, liquid, powder or pre-made brazing pastes that combine flux with filler metal powder. Flux can also be applied using brazing rods with a coating of flux, or a flux core.