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Sn 60 Pb 39 Cu 1: Pb: No: Sn 60 Pb 38 Cu 2: 183: 190 [16] [17] Pb: Cu2. Copper content increases hardness of the alloy and inhibits dissolution of soldering iron tips and part leads in molten solder. Sn 62 Pb 37 Cu 1: 183 [17] Pb: Yes: Similar to Sn 63 Pb 37. Copper content increases hardness of the alloy and inhibits dissolution of soldering ...
Yield strength (0.2% offset, ksi) Tensile strength (ksi) Elongation in 2 inches (percent) Hardness (Brinell scale) Comments Copper (ASTM B1, B2, B3, B152, B124, R133) Cu 99.9 Annealed 10 32 45 42 Electrical equipment, roofing, screens Cold-drawn 40 45 15 90 Cold-rolled 40 46 5 100 Gilding metal (ASTM B36) Cu 95.0, Zn 5.0 Cold-rolled 50 56 5 114
Sn 60 Pb 40 solder. Tin-lead (Sn-Pb) solders, also called soft solders, are commercially available with tin concentrations between 5% and 70% by weight.The greater the tin concentration, the greater the solder's tensile and shear strengths.
On slow cooling gives slightly brighter joints than Sn 60 Pb 40. [17] Yield strength 3,950 psi (27.2 MPa), tensile strength 4,442 psi (30.63 MPa). [18] Sn 91.0, Zn 9.0: 198 °C (388 °F) yes: KappAloy9 Designed specifically for Aluminum-to-Aluminum and Aluminum-to-Copper soldering. It has good corrosion resistance and tensile strength. Lies ...
Elastic properties describe the reversible deformation (elastic response) of a material to an applied stress.They are a subset of the material properties that provide a quantitative description of the characteristics of a material, like its strength.
Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder.It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [1] as it is near eutectic, with adequate thermal fatigue properties, strength, and wettability. [2]
Sn ↑ Pb ↓ Fl: thallium ← ... Lead's tensile strength, at 12–17 MPa, is low ... Pb 2 O 3, can be obtained at high pressure, along with several non ...
There is, on the market a solder composed by 49 wt% of Bi, 21 wt% of In, 18 wt% of Pb, and 12 wt% of Sn, called commercially solder 136. This alloy presents a density of 8.58 g/cm 3, tensile strength of 43 MPa, toughness of 14HB, eutectic temperature of 331 K (58 °C; 136.4 °F), thermic coefficient of expansion of 12.8×10 −6 /K. It is used ...