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Several variants of the original TO-5 package have the same cap dimensions but differ in the number and length of the leads (wires). Somewhat incorrectly, TO-5 and TO-39 are often used in manufacturer's literature as synonyms for any package with the cap dimensions of TO-5, regardless of the number of leads, or even for any package with the diameter of TO-5, regardless of the cap height and ...
Plastic small-outline no-lead package: QSOP: Quarter-size small-outline package: The terminal pitch is 0.635 mm. [3] SOIC: Small-outline integrated circuit: Also known as SOIC NARROW and SOIC WIDE: SOJ: Small-outline J-leaded package SON Small-outline no-lead package SSOP: Shrink small-outline package [3] TSOP: Thin small-outline package [3] TSSOP
Size comparison between (left to right) TO-8, TO-5 and TO-18 packages The typical TO-8 metal can package has a base diameter of 15.24 mm (0.600 in), a cap diameter of 12.29 mm (0.484 in), and a cap height of 7.62 mm (0.300 in). [1]
Size comparison of transistor packages. Two surface-mount packages, SOT23 and SOT223, are shown next to through-hole packages. A small outline transistor (SOT) is a family of small footprint, discrete surface mount transistor commonly used in consumer electronics. The most common SOT are SOT23 variations,. [1]
The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more.
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