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  2. RTV silicone - Wikipedia

    en.wikipedia.org/wiki/RTV_silicone

    No release agent is required, obviating post-production cleanup. Silicones also exhibit good chemical resistance and high-temperature resistance (205 °C, 400 °F and higher). For this reason, silicone molds are suitable for casting low-melt metals and alloys (e.g. zinc, tin, pewter, and Wood's metal).

  3. Hot-melt adhesive - Wikipedia

    en.wikipedia.org/wiki/Hot-melt_adhesive

    High melt flow index adhesives are easy to apply but have poor mechanical properties due to shorter polymer chains. ... High application temperature. High range of ...

  4. J-B Weld - Wikipedia

    en.wikipedia.org/wiki/J-B_Weld

    J-B Weld is a two-part epoxy adhesive (or filler) that can withstand high-temperature environments. J-B Weld can be used to bond surfaces made from metal, porcelain, ceramic, glass, marble, PVC, ABS, concrete, fiberglass, wood, fabric, or paper. [7] [8] Alcohol should be avoided when cleaning surfaces, as it can degrade the bond. [9]

  5. Thermal paste - Wikipedia

    en.wikipedia.org/wiki/Thermal_paste

    Aluminum oxide, boron nitride, zinc oxide, diamond and increasingly aluminum nitride are used as fillers for these types of adhesives. The filler loading can be as high as 70–80% by mass, and raises the thermal conductivity of the base matrix from 0.17–0.3 W/(m·K) (watts per meter-kelvin) [1] up to about 4 W/(m·K), according to a 2008 ...

  6. Heat sealer - Wikipedia

    en.wikipedia.org/wiki/Heat_sealer

    An electric current heats the heating element for a specified time to create the required temperature. The jaws hold the material in place after the heat is stopped, sometimes with cooling water: this allows the material to fuse before stress can be applied. [3] [4] [5] Hot melt adhesive can be applied in strips or beads at the point of joining ...

  7. Sodium silicate - Wikipedia

    en.wikipedia.org/wiki/Sodium_silicate

    Sodium silicate solutions can also be used as a spin-on adhesive layer to bond glass to glass [21] or a silicon dioxide–covered silicon wafer to one another. [22] Sodium silicate glass-to-glass bonding has the advantage that it is a low-temperature bonding technique, as opposed to fusion bonding. [21]

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