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  2. Paint adhesion testing - Wikipedia

    en.wikipedia.org/wiki/Paint_adhesion_testing

    In the paint and coating industries, paint adhesion testing is often used to determine if the paint or coating will adhere properly to the substrates to which they are applied. Several tests measure the resistance of paints and coatings from substrates: cross-cut test, scrape adhesion, pull-off test, and others. [1] Cross Cut Tester

  3. Delamination - Wikipedia

    en.wikipedia.org/wiki/Delamination

    ASTM provides standards for paint adhesion testing which provides qualitative measures for paints and coatings resistance to delamination from substrates. Tests include cross-cut test, scrape adhesion, [13] and pull-off test. [14]

  4. Pull off test - Wikipedia

    en.wikipedia.org/wiki/Pull_off_test

    A pull-off test, also called stud pull test, is a type of test in which an adhesive connection is made between a stud and a carrier (or object to be tested) by using a glue, possibly an epoxy or polyester resin, that is stronger than the bond that needs to be tested.

  5. Adhesion testing - Wikipedia

    en.wikipedia.org/?title=Adhesion_testing&redirect=no

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  6. Heat-shrinkable sleeve - Wikipedia

    en.wikipedia.org/wiki/Heat-shrinkable_sleeve

    A heat-shrinkable sleeve starts out with a thick extruded poly olefin sheet (polyethylene or polypropylene) that is formulated to be cross-linkable. After extruding the thick sheet, it is taken to the "beam" where it is passed under a unit that subjects the sheet to electron irradiation. [2] The irradiation process cross-links the polyolefin.

  7. Wafer bond characterization - Wikipedia

    en.wikipedia.org/wiki/Wafer_bond_characterization

    USB Tweezers performing cold bump pull (CPB) on a bond tester. Measuring bond strength by pull testing is often the best way to get the failure mode in which you are interested. Additionally, and unlike a shear test, as the bond separates, the fracture surfaces are pulled away from each other, cleanly enabling accurate failure mode analysis.

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