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Bare silicon chip, an early chip-scale package CSP: Chip-scale package: Package size is no more than 1.2× the size of the silicon chip [16] [17] TCSP: True chip-size package: Package is same size as silicon [18] TDSP: True die-size package: Same as TCSP [18] WCSP or WL-CSP or WLCSP: Wafer-level chip-scale package
The Indian Institute of Social Welfare & Business Management (IISWBM) is a Autonomous business school in Kolkata, India. The school is the first Management institute in India and South East Asia. [2] [3] The Institute presently offers several Post Graduate degree programmes under the University of Calcutta as well as the PhD programme.
The Thin shrink small outline package has a smaller body and smaller lead pitch than the standard SOIC package. It is also smaller and thinner than a TSOP with the same lead count. Body widths are 3.0 mm, 4.4 mm and 6.1 mm. The lead counts range from 8 to 80 pins. The lead pitches are 0.5 or 0.65 mm.
Small-outline integrated circuit. This package has 16 "gull wing" leads protruding from the two long sides and a lead spacing of 0.050 inches. Early integrated circuits were packaged in ceramic flat packs, which the military used for many years for their reliability and small size. The other type of packaging used in the 1970s, called the ICP ...
Shrink small-outline package (SSOP) chips have "gull wing" leads protruding from the two long sides, and a lead spacing of 0.65 mm (0.0256 inches) or 0.635 mm (0.025 inches ). [4] 0.5 mm lead spacing is less common, but not rare. The body size of a SOP was compressed and the lead pitch tightened to obtain a smaller version SOP.
Since only a few packages are chip size, the meaning of the acronym was adapted to chip-scale packaging. According to IPC 's standard J-STD-012, Implementation of Flip Chip and Chip Scale Technology , in order to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die and it must be a single-die, direct ...
The quad flat-pack has connections only around the periphery of the package. To increase the number of pins, the spacing was decreased from 50 mil (as found on small outline packages) to 20 and later 12 (1.27 mm, 0.51 mm and 0.30 mm respectively).
Transmission delay is a function of the packet's length and has nothing to do with the distance between the two nodes. This delay is proportional to the packet's length in bits. It is given by the following formula: = / seconds. where: is the transmission delay in seconds;