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  2. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    Bare silicon chip, an early chip-scale package CSP: Chip-scale package: Package size is no more than 1.2× the size of the silicon chip [16] [17] TCSP: True chip-size package: Package is same size as silicon [18] TDSP: True die-size package: Same as TCSP [18] WCSP or WL-CSP or WLCSP: Wafer-level chip-scale package

  3. Indian Institute of Social Welfare and Business Management

    en.wikipedia.org/wiki/Indian_Institute_of_Social...

    The Indian Institute of Social Welfare & Business Management (IISWBM) is a Autonomous business school in Kolkata, India. The school is the first Management institute in India and South East Asia. [2] [3] The Institute presently offers several Post Graduate degree programmes under the University of Calcutta as well as the PhD programme.

  4. Dimensional weight - Wikipedia

    en.wikipedia.org/wiki/Dimensional_weight

    If the package is a right-angled rectangular box , then this will be equal to the true volume of the package. However, if the package is of any other shape, then the calculation of volume will be more than the true volume of the package. Dimensional weight is also known as DIM weight, volumetric weight, or cubed weight.

  5. Talk:List of integrated circuit package dimensions - Wikipedia

    en.wikipedia.org/wiki/Talk:List_of_integrated...

    Perhaps contrary to some expectations, a particular package is not necessarily associated with a unique lead pitch (P in the table). Instead, the package name may refer to a particular package body size, with larger number of pins accommodated with finer pitch. Example: MSOP-8 with 0.65mm pitch, MSOP-10 with 0.5mm pitch.

  6. Average path length - Wikipedia

    en.wikipedia.org/wiki/Average_path_length

    All these models had one thing in common: they all predicted very short average path length. [1] The average path length depends on the system size but does not change drastically with it. Small world network theory predicts that the average path length changes proportionally to log n, where n is the number of nodes in the network.

  7. Embedded wafer level ball grid array - Wikipedia

    en.wikipedia.org/wiki/Embedded_Wafer_Level_Ball...

    The package interconnects are applied on an artificial wafer made of silicon chips and a casting compound. Principle eWLB. eWLB is a further development of the classical wafer level ball grid array technology (WLB or WLP: wafer level package). The main driving force behind the eWLB technology was to allow fanout and more space for interconnect ...

  8. File:Minimum Frame Length in Ethernet explained.webm

    en.wikipedia.org/wiki/File:Minimum_Frame_Length...

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  9. Mean line segment length - Wikipedia

    en.wikipedia.org/wiki/Mean_line_segment_length

    The average chord length between points on the circumference of a circle of radius r is [8] 4 π r ≈ 1.273239544 … r {\displaystyle {\frac {4}{\pi }}r\approx 1.273239544\ldots r} And picking points on the surface of a sphere with radius r is [ 9 ]