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A heat sink usually consists of a base with one or more flat surfaces and an array of comb or fin-like protrusions to increase the heat sink's surface area contacting the air, and thus increasing the heat dissipation rate. While a heat sink is a static object, a fan often aids a heat sink by providing increased airflow over the heat sink—thus ...
Polycarbonate is mainly used for electronic applications that capitalize on its collective safety features. A good electrical insulator with heat-resistant and flame-retardant properties, it is used in products associated with power systems and telecommunications hardware. It can serve as a dielectric in high-stability capacitors. [6]
Isothermalize a natural convection heat sink, increasing its efficiency and reducing its size. In one case, adding five heat pipes reduced the heat sink mass by 34%, from 4.4 kg to 2.9 kg. [7] Efficiently transform the high heat flux directly under an LED to a lower heat flux that can be removed more easily. [8]
In heat transfer, the thermal conductivity of a substance, k, is an intensive property that indicates its ability to conduct heat. For most materials, the amount of heat conducted varies (usually non-linearly) with temperature. [1] Thermal conductivity is often measured with laser flash analysis. Alternative measurements are also established.
The heat flow between the semiconductor die and ambient air is modeled as a series of resistances to heat flow; there is a resistance from the die to the device case, from the case to the heat sink, and from the heat sink to the ambient air. The sum of these resistances is the total thermal resistance from the die to the ambient air.
2 Basic heat sink heat transfer theory model. 3 Methods to determine heat sink thermal performance. 3.1 Heat transfer theoretical model 3.2 Experimental data 3.3 Numerical data 4 Design factors which influence the thermal performance of a heat sink. 4.1 Material 4.1.1 Fin efficiency 4.1.2 Spreading resistance 4.2 Fin arrangements 4.2.1 Pin fin