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Lead frame for a QFP package, before encapsulation DIP 16 pin Lead frame, after encapsulation and before cutting/separation. The lead frame consists of a central die pad, where the die is placed, surrounded by leads, metal conductors leading away from the die to the outside world. The end of each lead closest to the die ends in a bond pad.
Lead frame of a surface-mount technology package. Most kinds of integrated circuit packaging are made by placing a silicon chip on a lead frame, wire bonding the chip to the metal leads of the lead frame, and covering the chip with plastic. The metal leads protruding from the plastic are then either "cut long" and bent to form through-hole pins ...
Through-hole (leaded) resistors. In electronics, through-hole technology (also spelled "thru-hole") is a manufacturing scheme in which leads on the components are inserted through holes drilled in printed circuit boards (PCB) and soldered to pads on the opposite side, either by manual assembly (hand placement) or by the use of automated insertion mount machines.
Both versions are JEDEC compliant in all respects. The heatspreader versions give the system designer greater latitude in thermally-enhanced board level and/or system design. RoHS compliant, lead-free and green material sets are now qualified standards. Leaded chip carrier extraction tool. Vacuum picks may also be used instead.
Quad flat no-lead : smaller footprint than leaded equivalent; Leadless chip carrier (LCC): contacts are recessed vertically to "wick-in" solder. Common in aviation electronics because of robustness to mechanical vibration. Micro leadframe package (MLP, MLF): with a 0.5 mm contact pitch, no leads (same as QFN)
Electroplating (plates the copper leads of the lead frames with tin to make soldering easier) Laser marking or silkscreen printing; Trim and form (separates the lead frames from each other, and bends the lead frame's pins so that they can be mounted on a printed circuit board) IC testing; Additionally steps such as Wright etch may be carried out.
The standard further defines different types with varying parameters which includes package body material, terminal location, package outline, lead form and terminal count. The main vehicle for testing of high reliability flatpack packages has been MIL-PRF-38534 (General Specification for Hybrid Microcircuits). This document outlines the ...
For example, for a 14-lead DIP, with the notch at the top, the left leads are numbered from 1 to 7 (top to bottom) and the right row of leads are numbered 8 to 14 (bottom to top). Leads are skipped on some DIP devices (e.g. segmented LED displays , relays, or devices that replace leads with a heat sink fin).