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J-B Kwik is a faster-curing two-part epoxy with medium-temperature resistance up to 300 °F (149 °C). Although not as strong or heat-resistant as J-B Weld, it has the same adhesion and does not shrink when hardening.
An intermediate case involves a mixture of resin and additives that requires external stimulus (light, heat, radiation) to induce curing. The curing methodology depends on the resin and the application. Particular attention is paid to the shrinkage induced by the curing. Usually small values of shrinkage (2–3%) are desirable. [2]
In the epoxy industry it is often referred to as PACM, short for para-diaminodicyclohexylmethane. It is used as a curing agent for epoxy resins [1] It finds particular use in epoxy flooring. [2] Another use is to produce diisocyanates, which are precursors to polyurethanes. The mixture is a colorless solid, but typical samples are yellowish ...
At that time they also acquired Pacific Epoxy Products. [3] In 2010, the parent holding companies of Momentive Performance Materials Inc. and Hexion Specialty Chemicals Inc. merged to form Momentive Performance Materials Holdings LLC. [4] In 2015, this combined company renamed itself to Hexion Inc.
The curing process is by condensation and a typical figure for Redux Liquid 775/Powder 775 is 30 minutes at 293 °F (145 °C) under a pressure of 100 psi (690 kPa). This is not critical and variations in curing-time and/or temperature may be used to increase shear and creep strength at temperatures above 140 °F (60 °C).
In between adhesive application, assembly and curing, the product can be held for a period of time, without sacrificing performance. Attempts to use traditional epoxies in IC packaging often created expensive production bottlenecks, because, as soon as the epoxy adhesive was applied, the components had to be assembled and cured immediately. B ...