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The MIL-STD-883 standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within military and aerospace electronic systems including basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations; mechanical and electrical tests; workmanship and ...
The HBM definition most widely used is the test model defined in the United States military standard, MIL-STD-883, Method 3015.9, Electrostatic Discharge Sensitivity Classification. This method establishes a simplified equivalent electrical circuit and the necessary test procedures required to model an HBM ESD event.
MIL-T-27730A (an obsolete military specification still commonly used in industry in the US) requires a minimum thickness of 3.5 mils and a minimum PTFE purity of 99%. [3] The second standard, A-A-58092, [ 4 ] is a commercial grade which maintains the thickness requirement of MIL-T-27730A and adds a minimum density of 1.2 g/cm 3 . [ 4 ]
Petroleum-based pipe dope is not intended for use on threaded PVC, CPVC or ABS pipe and fittings since it will deteriorate the plastic. Builders in the US are expected to use thread compounds that meet ASTM F2331 - Standard Test Method for Determining Chemical Compatibility of Thread Sealants with Thermoplastic Threaded Pipe and Fittings Materials or thread seal tape on PVC, CPVC and ABS threads.
MIL-STD-810, test methods for determining the environmental effects on equipment [24] MIL-STD-882, standard practice for system safety [25] MIL-STD-883, test method standard for microcircuits [26] MIL-STD-1168, a classification system for ammunition production that replaced the Ammunition Identification Code (AIC) system used during World War II.
A pull-off test, also called stud pull test, is a type of test in which an adhesive connection is made between a stud and a carrier (or object to be tested) by using a glue, possibly an epoxy or polyester resin, that is stronger than the bond that needs to be tested.
According to method 2020.9 of MIL-STD-883 and method 2052.5 of MIL-STD-750, the purpose of a PIND test is to detect loose particles inside an electronics device cavity. The test provides a nondestructive means of identifying those devices containing particles of sufficient mass that, upon impact within the cavity, excite the transducer .
MIL-I-17563 tests the impregnation sealant. MIL-I-17563C demonstrates a sealant is compatible with the application and that the sealant will not degrade or fail over the life of the part. MIL-STD-276A tests the impregnation process. MIL-STD-276A provides the standards for processing to seal parts and testing process effectiveness. [3]