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  2. Disc cutter - Wikipedia

    en.wikipedia.org/wiki/Disc_cutter

    The most common size for these cutting wheels is 4 + 1 ⁄ 2 inches in diameter; however they can range from 2 to 16 inches in diameter with a thickness range from .045 in. to .125 in. Type 1 discs are flat, and type 27 discs have a raised hub. These wheels are strong but are not immune to breaking.

  3. Angle grinder - Wikipedia

    en.wikipedia.org/wiki/Angle_grinder

    Generally, disc size and power increase together. Disc size is usually measured in inches or millimeters. Common disc sizes for angle grinders in the United States include 4, 4.5, 5, 6, 7, 9 and 12 inches, with the most popular sizes being the 4.5 and 5" size. In Europe, the most common sizes for angle grinder discs are 115 and 125 millimeters.

  4. Ridgid - Wikipedia

    en.wikipedia.org/wiki/Ridgid

    The company was founded in 1923 in North Ridgeville, Ohio. [1] In 1943, it relocated to its current location in Elyria, Ohio, and in 1966, it became a wholly owned subsidiary of Emerson Electric. [2] Ridgid tools are targeted at the plumbing, pipe fitting, construction, and HVAC trades.

  5. Demonic dad allegedly beheads 1-year-old son with knife after ...

    www.aol.com/demonic-dad-allegedly-beheads-1...

    A demonic California dad has been arrested for allegedly beheading his 1-year-old son Friday in an early-morning frenzy of violence that also injured his wife and her mother, according to police.

  6. Leeza Gibbons Reveals the Real Reason She Left Hollywood ...

    www.aol.com/lifestyle/leeza-gibbons-reveals-real...

    For 30 years, Rose Bowl co-host Leeza Gibbons, 67, had a near-constant presence on network television.. From 1984 to 2000, she was a correspondent and co-host of Entertainment Tonight, and the ...

  7. Disco Corporation - Wikipedia

    en.wikipedia.org/wiki/Disco_Corporation

    DISCO Corporation (株式会社ディスコ, Kabushiki-gaisha Disuko) is a Japanese precision tools maker, especially for the semiconductor production industry.. The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage ...