When.com Web Search

  1. Ads

    related to: lead forming tools for electronics engineering and technology

Search results

  1. Results From The WOW.Com Content Network
  2. Through-hole technology - Wikipedia

    en.wikipedia.org/wiki/Through-hole_technology

    Through-hole (leaded) resistors. In electronics, through-hole technology (also spelled "thru-hole") is a manufacturing scheme in which leads on the components are inserted through holes drilled in printed circuit boards (PCB) and soldered to pads on the opposite side, either by manual assembly (hand placement) or by the use of automated insertion mount machines.

  3. Lead frame - Wikipedia

    en.wikipedia.org/wiki/Lead_frame

    Lead frame for a QFP package, before encapsulation DIP 16 pin Lead frame, after encapsulation and before cutting/separation. The lead frame consists of a central die pad, where the die is placed, surrounded by leads, metal conductors leading away from the die to the outside world. The end of each lead closest to the die ends in a bond pad.

  4. Lead (electronics) - Wikipedia

    en.wikipedia.org/wiki/Lead_(electronics)

    Lead frame of a surface-mount technology package. Most kinds of integrated circuit packaging are made by placing a silicon chip on a lead frame, wire bonding the chip to the metal leads of the lead frame, and covering the chip with plastic. The metal leads protruding from the plastic are then either "cut long" and bent to form through-hole pins ...

  5. Whisker (metallurgy) - Wikipedia

    en.wikipedia.org/wiki/Whisker_(metallurgy)

    The European Restriction of Hazardous Substances Directive (RoHS), which took effect on July 1, 2006, restricted the use of lead in various types of electronic and electrical equipment. This has driven the use of lead-free alloys with a focus on preventing whisker formation (see § Mitigation and elimination). Others have focused on the ...

  6. Semiconductor device fabrication - Wikipedia

    en.wikipedia.org/wiki/Semiconductor_device...

    Silicon on insulator (SOI) technology has been used in AMD's 130 nm, 90 nm, 65 nm, 45 nm and 32 nm single, dual, quad, six and eight core processors made since 2001. [73] During the transition from 200 mm to 300 mm wafers in 2001, many bridge tools were used which could process both 200 mm and 300 mm wafers. [74]

  7. Diffusion bonding - Wikipedia

    en.wikipedia.org/wiki/Diffusion_bonding

    Diffusion bonding is primarily used to create intricate forms for the electronics, aerospace, nuclear, and microfluidics industries. Since this form of bonding takes a considerable amount of time compared to other joining techniques such as explosion welding , parts are made in small quantities, and often fabrication is mostly automated.

  8. Discover the latest breaking news in the U.S. and around the world — politics, weather, entertainment, lifestyle, finance, sports and much more.

  9. Spring Back Compensation - Wikipedia

    en.wikipedia.org/wiki/Spring_Back_Compensation

    Electronic bending tool with integrated angle measurement and spring-back compensation Manufacturing of electrical assemblies produces components that are flat, using copper and aluminum. The mechanical properties of copper and aluminum are very different and require different programmable inputs in order to achieve the same dimensional ...