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Choice of I/O backplane: PCI-X with 8 available PCI-X slots, or the PCI Express I/O backplane, containing 4 x8 PCI Express slots, and 4 PCI-X slots. The system also has 2 reserved PCI-X slots, one of which is used for a PCI-X dual-port 10/100/1000Base TX LAN card, and the other is reserved for an optional internal Smart Array RAID card.
HP P10000 3PAR Storage System. The HPE Storage (formerly HP StorageWorks) is a portfolio of Hewlett Packard Enterprise storage products, includes online storage, nearline storage, storage networking, archiving, de-duplication, and storage software.
HPE now owns the ProLiant brand after HP split up into two separate companies in 2015. The HP/HPE ProLiant servers offer many advanced server features such as redundant power supplies, Out-of-band management with iLO or Lights-out 100, Hot-swap components and up to 8-Socket systems.
As of June 2018 the most recent Chassis Manager Firmware available is version 1.56 which was released as part of the Moonshot Component Pack 2018.02.0. [8] Although HP included iLO functionality in the ProLiant Gen8 MicroServer, they removed it from the Gen10 version. The ProLiant MicroServer Gen10+ and Gen11 has an iLO add-on card.
On August 16, 2010, Dell announced that it would acquire 3PAR in a transaction valued at approximately $1.15 billion, net of 3PAR's cash. [10]Following that, on August 23, 2010, Hewlett-Packard Company (HP) announced it had offered $1.5 billion (30% higher than Dell's offer) to acquire 3PAR in a letter sent to 3PAR's president and CEO.
HP OpenView is the former name for a Hewlett-Packard product family that consisted of network and systems management products. In 2007, HP OpenView was rebranded as HP BTO (Business Technology Optimization) Software when it became part of the HP Software Division.
A disk array controller is a device that manages the physical disk drives and presents them to the computer as logical units. It often implements hardware RAID , thus it is sometimes referred to as RAID controller .
Advanced packaging includes multi-chip modules, 3D ICs, [2] 2.5D ICs, [2] heterogeneous integration, [3] fan-out wafer-level packaging, [2] system-in-package, quilt packaging, combining logic (processors) and memory in a single package, die stacking, wafer bonding/stacking, several chiplets or dies in a package, [2] combinations of these ...