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English: Schematic structure of a CMOS chip, like it is built in the early 2000s. The graphic shows LDD-MISFET's on a SOI silicon substrate with five metallization layers and solder bump for flip-chip bonding. Also it shows the section for FEOL (front-end of line), BEOL (back-end of line) and first parts of back-end process.
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Companies portal United States portal Semiconductor companies of the United States — companies designing and/or manufacturing semiconductor products in the U.S.
pSemi (formerly Peregrine Semiconductor), is a San Diego–based manufacturer of high-performance RF (radio frequency) CMOS integrated circuits.A Murata Manufacturing company since December 2014, the company's products are used in aerospace and defense, broadband, industrial, mobile wireless device, test and measurement equipment and wireless infrastructure markets. [2]
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Later-on, Intersil had a development contract with the Japanese company Daini Seikosha and became supplier of low-voltage CMOS watch ICs for Seiko. [6] When microprocessors emerged to the market in the 1970s, Intersil participated with its 12-bit IM6100 , which was the first microprocessor produced in CMOS technology and emulated the PDP-8 ...
The chip is implemented in 1.0-micrometre, two-level, metal CMOS, dissipates 0.8 watt, and is packaged in a 208-pin PQFP. A relatively low clock rate of 12.5 MHz is used. The Maspar machines are front ended by a host machine, usually a VAX. They are accessed by extensions to Fortran and C. Full IEEE single- and double-precision floating point ...