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For low-temperature soldering of heat-sensitive parts, and for soldering in the vicinity of already soldered joints without their remelting. Sn 43 Pb 43 Bi 14: 144: 163 [11] Pb: No: Bi14. Good fatigue resistance combined with low melting point. Contains phases of tin and lead-bismuth. [13] Useful for step soldering. Sn 46 Pb 46 Bi 8: 120: 167 ...
Solder is melted in order to wet the parts of the joint, where it adheres to and connects the pieces after cooling. Metals or alloys suitable for use as solder should have a lower melting point than the pieces to be joined. The solder should also be resistant to oxidative and corrosive effects that would degrade the joint over time.
Combination with lead-tin solder may dramatically lower melting point and lead to joint failure. [10] Low-temperature eutectic solder with high strength. [11] Particularly strong, very brittle. [12] Used extensively in through-hole technology assemblies in IBM mainframe computers where low soldering temperature
Extra-easy solder contains 56% silver and has a melting point of 618 °C (1,145 °F). Extra-hard solder has 80% silver and melts at 740 °C (1,370 °F). If multiple joints are needed, then the jeweler will start with hard or extra-hard solder and switch to lower-temperature solders for later joints.
Low vapor pressure, suitable for vacuum work. Good ductility. Also classified as a solder. Lowest melting point alloy with low vapor pressure. 80: 20: Au 88 Ge 12: Au 356 [54] – Au88, Indalloy 183, Premabraze 880, Georo. Eutectic. Low ductility. Used for die attachment of some chips. The high temperature may be detrimental to the chips and ...
Bismuth significantly improves the wettability of the solder. When the composition is more than 47% Bi, the alloy will expand upon cooling. Cadmium quickly oxidizes, resulting in tarnish and slow soldering. It improves the mechanical properties of the alloys. Indium lowers the melting point at a rate of 1.45 °C per 1 wt% of added In. It easily ...