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The pad and wafer are pressed together by a dynamic polishing head and held in place by a plastic retaining ring. The dynamic polishing head is rotated with different axes of rotation (i.e., not concentric). This removes material and tends to even out any irregular topography, making the wafer flat or planar. This may be necessary to set up the ...
Etching is a critically important process module in fabrication, and every wafer undergoes many etching steps before it is complete. For many etch steps, part of the wafer is protected from the etchant by a "masking" material which resists etching. In some cases, the masking material is a photoresist which has been patterned using photolithography.
Laurell Technologies WS-400 spin coater used to apply photoresist to the surface of a silicon wafer. Spin coating is a procedure used to deposit uniform thin films onto flat substrates. Usually a small amount of coating material in liquid form is applied on the center of the substrate, which is either spinning at low speed or not spinning at all.
Wafer backgrinding is a semiconductor device fabrication step during which wafer thickness is reduced to allow stacking and high-density packaging of integrated circuits (IC). ICs are produced on semiconductor wafers that undergo a multitude of processing steps.
Polishing may be used to enhance and restore the looks of certain metal parts or object on cars and other vehicles, handrails, cookware, kitchenware, and architectural metal. In other applications such as pharmaceutical, dairy, and specialty plumbing, pipes are buffed to help prevent corrosion and to eliminate locations where bacteria or mold ...
How It's Made is a documentary television series that premiered on January 6, 2001, on the Discovery Channel in Canada and Science in the United States. The program is produced in the Canadian province of Quebec by Productions MAJ, Inc. and Productions MAJ 2.
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The wafer is lifted by the wafer prober until metal pads on one or more ICs on the wafer make physical contact with the probes. A certain amount of over-travel is required after the first probe makes contact with the wafer, for two reasons: to guarantee that all probes have made contact (to account for non-planarity of the wafer)