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The first DDR4 memory module prototype was manufactured by Samsung and announced in January 2011. [a] Physical comparison of DDR, DDR2, DDR3, and DDR4 SDRAM Front and back of 8 GB [1] DDR4 memory modules. 2005: Standards body JEDEC began working on a successor to DDR3 around 2005, [14] about 2 years before the launch of DDR3 in 2007.
The DDR4 SDRAM is a high-speed dynamic random-access memory internally configured as 16 banks, 4 bank groups with 4 banks for each bank group for ×4/×8 and 8 banks, 2 bank groups with 4 banks for each bank group for ×16 DRAM. The DDR4 SDRAM uses an 8n prefetch architecture to achieve high-speed
XM (requires an eXternal electro-mechanical adapter) – Technically the same as EM, but such adapter usually consists of 2 parts: a pseudo-card with pin routing and physical enclosure size that perfectly match the target slot and a break-out box (a card reader) that holds a real card. Such adapter is the least comfortable to use.
In June 2020, Lexar announced its entry to the DRAM market by unveiling seven different DDR4-2666 memory kits for mainstream laptops and desktops. Lexar also plans to release faster, 3000 MHz and 3200 MHz memory kits in the future, along with kits "with heatsinks and RGB lighting", targeting gamers and enthusiasts.
A DIMM (Dual In-Line Memory Module) is a popular type of memory module used in computers. It is a printed circuit board with one or both sides (front and back) holding DRAM chips and pins . [ 1 ] The vast majority of DIMMs are manufactured in compliance with JEDEC memory standards , although there are proprietary DIMMs.
PC133 is a computer memory standard defined by the JEDEC. PC133 refers to SDR SDRAM operating at a clock frequency of 133 MHz, on a 64-bit-wide bus, at a voltage of 3.3 V. PC133 is available in 168-pin DIMM and 144-pin SO-DIMM form factors. PC133 is the fastest and final SDR SDRAM standard ever approved by the JEDEC, and delivers a bandwidth of ...