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Siemens NX. NX, formerly known as "Unigraphics", is an advanced high-end CAD / CAM / CAE, which has been owned since 2007 by Siemens Digital Industries Software. [1][2] In 2000, Unigraphics purchased SDRC I-DEAS and began an effort to integrate aspects of both software packages into a single product which became Unigraphics NX or NX.
Plastic leaded chip carrier (PLCC): square, J-lead, pin spacing 1.27 mm. Quad flat package (QFP): various sizes, with pins on all four sides. Low-profile quad flat-package (LQFP): 1.4 mm high, varying sized and pins on all four sides. Plastic quad flat-pack (PQFP), a square with pins on all four sides, 44 or more pins.
This page is a comparison of electronic design automation (EDA) software which is used today to design the near totality of electronic devices. Modern electronic devices are too complex to be designed without the help of a computer. Electronic devices may consist of integrated circuits (ICs), printed circuit boards (PCBs), field-programmable ...
Integrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board. The packaging stage is followed by testing of the ...
GOMA is an open-source, parallel, and scalable multiphysics software package for modeling and simulation of real-life physical processes, with a basis in computational fluid dynamics for problems with evolving geometry. A generic finite element library written in C++ with interfaces for Python, Matlab and Scilab.
NASTRAN is a finite element analysis (FEA) program that was originally developed for NASA in the late 1960s under United States government funding for the aerospace industry. The MacNeal-Schwendler Corporation (MSC) was one of the principal and original developers of the publicly available NASTRAN code. [1][2] NASTRAN source code is integrated ...
System in a package. A system in a package (SiP) or system-in-package is a number of integrated circuits (ICs) enclosed in one chip carrier package or encompassing an IC package substrate that may include passive components and perform the functions of an entire system. The ICs may be stacked using package on package, placed side by side, and ...
Siemens Digital Industries Software (formerly UGS and then Siemens PLM Software) is an American computer software company specializing in 3D & 2D Product Lifecycle Management (PLM) software. The company is a business unit of Siemens, operates under the legal name of Siemens Industry Software Inc, and is headquartered in Plano, Texas.