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The removal of these worn grains from the adhesive bonds restores the wheel’s cutting ability once more. [4] Grinding wheels can also be characterized by the grains’ increased capacity to fracture according to a level of higher value of friability. Different bonding materials are used depending on the intended use of the grinding wheel.
The wheels are generally made with composite material. This consists of coarse-particle aggregate pressed and bonded together by a cementing matrix (called the bond in grinding wheel terminology) to form a solid, circular shape. Various profiles and cross sections are available depending on the intended usage for the wheel.
There are two common methods to manufacture diamond grinding cup wheels: hot pressing and cold pressing. The hot pressing method is to directly sinter the diamond segments in molds under a certain pressure in the dedicated sintering press machine, and then fix or connect the diamond segments onto the grinding wheel’s body via high-frequency welding, laser welding or mechanical mosaic method.
As the name indicates, in Fusion bonded epoxy coatings the resin part is an "epoxy" type resin. “Epoxy” or “Oxirane” structure contains a three membered cyclic ring — one oxygen atom connected to two carbon atoms – in the resin molecule. This part is the most reactive group in the epoxy resins.
After evaporation of the solvent, a solid compound is formed. Chemical bonds are also important in certain adhesive / substrate combinations, for example when bonding glass using silicone adhesives, wood using polyurethane adhesives and aluminium using epoxy adhesives. Chemical bonding leads to significantly higher adhesion than physical bonding.
Grinding is a subset of cutting, as grinding is a true metal-cutting process. Each grain of abrasive functions as a microscopic single-point cutting edge (although of high negative rake angle), and shears a tiny chip that is analogous to what would conventionally be called a "cut" chip (turning, milling, drilling, tapping, etc.) [citation needed].