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Dip soldering is a small-scale soldering process by which electronic components are soldered to a printed circuit board (PCB) to form an electronic assembly. The solder wets to the exposed metallic areas of the board (those not protected with solder mask), creating a reliable mechanical and electrical connection.
Printed circuit board of a DVD player. Part of a 1984 Sinclair ZX Spectrum computer board, a printed circuit board, showing the conductive traces, the through-hole paths to the other surface, and some electronic components mounted using through-hole mounting. A printed circuit board (PCB), also called printed wiring board (PWB), is a medium ...
Soldering. Desoldering a contact from a wire. Soldering (US: / ˈsɒdərɪŋ /; UK: / ˈsoʊldərɪŋ /) is a process of joining two metal surfaces together using a filler metal called solder. The soldering process involves heating the surfaces to be joined and melting the solder, which is then allowed to cool and solidify, creating a strong ...
Tin-silver-copper. Tin-silver-copper (Sn - Ag - Cu, also known as SAC), is a lead-free (Pb-free) alloy commonly used for electronic solder. It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [1] as it is near eutectic, with adequate thermal fatigue properties, strength, and wettability. [2]
Potting (electronics) A small transformer potted in epoxy. The surface visible on the right is formed by the potting compound that has been poured into the plastic box. In electronics, potting is the process of filling a complete electronic assembly with a solid or gelatinous compound. This is done to exclude water, moisture, or corrosive ...
Many plug and socket connectors are attached to a wire or cable by soldering conductors to electrodes on the back of the connector. Soldered joints in connectors are robust and reliable if executed correctly, but are usually slower to make than crimped connections. [ 1 ]
Twist-on wire connectors. Twist-on wire connectors are a type of electrical connector used to fasten two or more low-voltage (or extra-low-voltage) electrical conductors. They are widely used in North America and several European countries in residential, commercial and industrial building power wiring, but have been banned in some other ...
Wire bonding is a method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Wire bonding can also be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another, although these are less common. Wire ...