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Soldering. Desoldering a contact from a wire. Soldering (US: / ˈsɒdərɪŋ /; UK: / ˈsoʊldərɪŋ /) is a process of joining two metal surfaces together using a filler metal called solder. The soldering process involves heating the surfaces to be joined and melting the solder, which is then allowed to cool and solidify, creating a strong ...
A fusible alloy is a metal alloy capable of being easily fused, i.e. easily meltable, at relatively low temperatures. Fusible alloys are commonly, but not necessarily, eutectic alloys. Sometimes the term "fusible alloy" is used to describe alloys with a melting point below 183 °C (361 °F; 456 K). Fusible alloys in this sense are used for solder.
For low-temperature soldering of heat-sensitive parts, and for soldering in the vicinity of already soldered joints without their remelting. Sn 43 Pb 43 Bi 14: 144: 163 [11] Pb: No: Bi14. Good fatigue resistance combined with low melting point. Contains phases of tin and lead-bismuth. [13] Useful for step soldering. Sn 46 Pb 46 Bi 8: 120: 167 ...
A desoldering pump, colloquially known as a solder sucker, is a manually-operated device which is used to remove solder from a printed circuit board. There are two types: the plunger style and bulb style. [1] (. An electrically-operated pump for this purpose would usually be called a vacuum pump.)
In electronics, rework (or re-work) is the repair or refinish of a printed circuit board (PCB) assembly, usually involving desoldering and re- soldering of surface-mounted electronic components (SMD). Mass processing techniques are not applicable to single device repair or replacement, and specialized manual techniques by expert personnel using ...
Tin-silver-copper. Tin-silver-copper (Sn - Ag - Cu, also known as SAC), is a lead-free (Pb-free) alloy commonly used for electronic solder. It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [1] as it is near eutectic, with adequate thermal fatigue properties, strength, and wettability. [2]
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