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Common features of Ryzen 5000 (Cezanne) desktop CPUs: Socket: AM4. CPUs support DDR4-3200 in dual-channel mode. L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. L2 cache: 512 KB per core. CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset. No integrated graphics. Fabrication process: TSMC 7FF.
Ryzen 5 7600 Ryzen 7 7700 Ryzen 9 7900 6/8/12 3700–3800 (5100–5400 boost) April 2023 Ryzen 7 7800X3D 8 4200 (5000 boost) 96 MB February 2023 Ryzen 9 7900X3D Ryzen 9 7950X3D 12/16 4200–4400 (5600–5700 boost) 96+32 MB March 2023 Phoenix Ryzen 7040 6/8 3800–4300 (5000–5200)
Rembrandt-R Ryzen 7035 series (laptop) Zen 4 series CPUs and APUs (released 2022) ... List of AMD Ryzen processors; List of AMD CPU microarchitectures;
AMD Ultrathin Platform introduced on January 5, 2011, as the fourth AMD mobile platform targeting the ultra-portable notebook market. It features the 40 nm AMD Ontario (a 9-watt AMD APU for netbooks and small form factor desktops and devices) and Zacate (an 18-watt TDP APU for ultrathin, mainstream, and value notebooks as well as desktops and ...
Common features of Ryzen 7000 desktop CPUs: Socket: AM5. All the CPUs support DDR5-5200 in dual-channel mode. L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. L2 cache: 1 MB per core. All the CPUs support 28 PCIe 5.0 lanes. 4 of the lanes are reserved as link to the chipset.
AMD announced the Brazos-T platform on 9 October 2012. It comprised the 4.5-watt AMD Z-Series APU (codenamed Hondo) and the A55T Fusion Controller Hub (FCH), designed for the tablet computer market. [42] [43] The Hondo APU is a redesign of the Desna APU. AMD lowered energy use by optimizing the APU and FCH for tablet computers. [44] [45]