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  2. Thermal paste - Wikipedia

    en.wikipedia.org/wiki/Thermal_paste

    Thermal paste is an example of a thermal interface material. As opposed to thermal adhesive, thermal paste does not add mechanical strength to the bond between heat source and heat sink. It has to be coupled with a fastener such as screws to hold the heat sink in place and to apply pressure, spreading and thinning the thermal paste.

  3. Socket AM4 - Wikipedia

    en.wikipedia.org/wiki/Socket_AM4

    Socket AM4 is a PGA microprocessor socket used by AMD's central processing units (CPUs) built on the Zen (including Zen+, Zen 2 and Zen 3) and Excavator microarchitectures. [ 1 ] [ 2 ] AM4 was launched in September 2016 and was designed to replace the sockets AM3+ , FM2+ and FS1b as a single platform.

  4. Thermal adhesive - Wikipedia

    en.wikipedia.org/wiki/Thermal_adhesive

    Thermal adhesive is a type of thermally conductive glue used for electronic components and heat sinks. It can be available as a paste (similar to thermal paste) or as a double-sided tape. [1] It is commonly used to bond integrated circuits to heatsinks where there are no other mounting mechanisms available.

  5. Computer cooling - Wikipedia

    en.wikipedia.org/wiki/Computer_cooling

    The user should also clean the fans thoroughly, since dust and debris can increase the ambient case temperature and impact fan performance. The best way to do so is with compressed air in an open space. Another preemptive technique to prevent damage is to replace the thermal paste regularly. [2]

  6. Heat sink - Wikipedia

    en.wikipedia.org/wiki/Heat_sink

    Thermal adhesive or thermal paste improve the heat sink's performance by filling air gaps between the heat sink and the heat spreader on the device. A heat sink is usually made out of a material with a high thermal conductivity , such as aluminium or copper.

  7. Thermally conductive pad - Wikipedia

    en.wikipedia.org/wiki/Thermally_conductive_pad

    In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper).

  8. Saving IndyCar's Thermal Club experiment: 9 ways to improve ...

    www.aol.com/saving-indycars-thermal-club...

    The pack races down the main straight and into turn seven during the first heat race of the $1 Million Challenge at The Thermal Club in Thermal, Calif., Sunday, March 24, 2024. Hold some version ...

  9. Aluminium joining - Wikipedia

    en.wikipedia.org/wiki/Aluminium_joining

    Aluminium alloys are often used due to their high strength-to-weight ratio, corrosion resistance, low cost, high thermal and electrical conductivity.There are a variety of techniques to join aluminium including mechanical fasteners, welding, adhesive bonding, brazing, soldering and friction stir welding (FSW), etc. Various techniques are used based on the cost and strength required for the joint.