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In photolithography, several masks are used in turn, each one reproducing a layer of the completed design, and together known as a mask set. A curvilinear photomask has patterns with curves, which is a departure from conventional photomasks which only have patterns that are completely vertical or horizontal, known as manhattan geometry.
Contact printing/lithography is liable to damage both the mask and the wafer, [38] and this was the primary reason it was abandoned for high volume production. Both contact and proximity lithography require the light intensity to be uniform across an entire wafer, and the mask to align precisely to features already on the wafer.
An illustration of OPC (Optical Proximity Correction). The blue Γ-like shape is what chip designers would like printed on a wafer, in green is the pattern on a mask after applying optical proximity correction, and the red contour is how the shape actually prints on the wafer (quite close to the desired blue target).
Contact lithography, also known as contact printing, is a form of photolithography whereby the image to be printed is obtained by illumination of a photomask in direct contact with a substrate coated with an imaging photoresist layer.
A SÜSS MicroTec MA6 mask aligner. An aligner, or mask aligner, is a system that produces integrated circuits (IC) using the photolithography process. It holds the photomask over the silicon wafer while a bright light is shone through the mask and onto the photoresist. The "alignment" refers to the ability to place the mask over precisely the ...
With a proper optical imaging system between the mask and the wafer (or no imaging system if the mask is sufficiently closely positioned to the wafer such as in early lithography machines), the mask pattern is imaged on a thin layer of photoresist on the surface of the wafer and a light (UV or EUV)-exposed part of the photoresist experiences ...
In semiconductor device fabrication, the inverse lithography technology (ILT) is an approach to photomask design. It is basically an approach to solve an inverse imaging problem : to calculate the shapes of the openings in a photomask ("source") so that the passing light produces a good approximation of the desired pattern ("target") on the ...
By making the off-axis illumination (i.e., the light is illuminating the mask at an oblique angle), all the diffraction orders from the mask are tilted, which makes it more likely that the higher diffraction orders can make it through the projection lens and help form the image of the mask onto the wafer.