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Illustration of the airflow of the cooling air in a computer case during computer cooling. Desktop computers typically use one or more fans for cooling. While almost all desktop power supplies have at least one built-in fan, power supplies should never draw heated air from within the case, as this results in higher PSU operating temperatures ...
Using the equations 5 to 13 and the dimensional data in, [24] the thermal resistance for the fins was calculated for various air flow rates. The data for the thermal resistance and heat transfer coefficient are shown in the diagram, which shows that for an increasing air flow rate, the thermal resistance of the heat sink decreases.
Water-cooling radiator transfers a lot of heat, and radiator fans have large static pressure (opposed to case fans that have high airflow) for dissipating heat. Laptop computers lack large openings in the case for warm air to escape. The laptop may be placed on a cooler – somewhat like a tray with fans built in – to ensure adequate cooling.
Overclocking has always meant greater cooling needs, and the inherently hotter chips meant more concerns for the enthusiast. Efficient heat sinks are vital to overclocked computer systems because the higher a microprocessor's cooling rate, the faster the computer can operate without instability; generally, faster operation leads to higher ...
A Cooler Master computer heat sink has many heat pipes. CPU cooler Thermalright Le Grand Macho RT installed into the computer case. Air cooling is a method of dissipating heat. It works by expanding the surface area or increasing the flow of air over the object to be cooled, or both.
Electronics cooling encompasses thermal design, analysis and experimental characterization of electronic systems as a discrete discipline with the product creation process for an electronics product, or an electronics sub-system within a product (e.g. an engine control unit (ECU) for a car).
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Chassis Air Guide or CAG in abbreviation, is Intel's thermal system to PC chassis. The system includes an air duct for CPU, because in an environment of increasing thermal loads, the processor is generally the most demanding component in terms of system thermal design. It also describes optimal locations for intake and exhaust fans.