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  2. Electroplating - Wikipedia

    en.wikipedia.org/wiki/Electroplating

    Electroplating, also known as electrochemical deposition or electrodeposition, is a process for producing a metal coating on a solid substrate through the reduction ...

  3. Die (integrated circuit) - Wikipedia

    en.wikipedia.org/wiki/Die_(integrated_circuit)

    Most dies are composed of silicon and used for integrated circuits. The process begins with the production of monocrystalline silicon ingots. These ingots are then sliced into disks with a diameter of up to 300 mm. [3] [4] Typical NPN transistor. Size of die is roughly 1 mm × 1 mm.

  4. Electroless nickel-phosphorus plating - Wikipedia

    en.wikipedia.org/wiki/Electroless_nickel...

    A disadvantage is the higher cost of the chemicals, which are consumed in proportion to the mass of nickel deposited; whereas in electroplating the nickel ions are replenished by the metallic nickel anode. Automatic mechanisms may be needed to replenish those reagents during plating.

  5. Chrome plating - Wikipedia

    en.wikipedia.org/wiki/Chrome_plating

    Chrome plating (less commonly chromium plating) is a technique of electroplating a thin layer of chromium onto a metal object. A chrome plated part is called chrome, or is said to have been chromed. The chromium layer can be decorative, provide corrosion resistance, facilitate cleaning, and increase surface hardness. Sometimes a less expensive ...

  6. Electroless deposition - Wikipedia

    en.wikipedia.org/wiki/Electroless_deposition

    Electroless deposition is advantageous in comparison to PVD, CVD, and electroplating deposition methods because it can be performed at ambient conditions. [2] [6] The plating method for Ni-P, Ni-Au, Ni-B, and Cu baths are distinct; however, the processes involve the same approach. The electroless deposition process is defined by four steps: [2 ...

  7. Copper electroplating - Wikipedia

    en.wikipedia.org/wiki/Copper_electroplating

    Copper electroplating is the process of electroplating a layer of copper onto the surface of a metal object. Copper is used both as a standalone coating and as an undercoat onto which other metals are subsequently plated. [ 1 ]