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Side view of a PCB showing a solder bead and test probe. Bead probe technology is a probing method used to connect electronic test equipment to the device under test (DUT) within a bed of nails fixture. The technique was first used in the 1990s [3] and originally given the name “Waygood Bump” after one of the main proponents, Rex Waygood.
A common form of in-circuit testing uses a bed-of-nails tester.This is a fixture that uses an array of spring-loaded pins known as "pogo pins". When a printed circuit board is aligned with and pressed down onto the bed-of-nails tester, the pins make electrical contact with locations on the circuit board, allowing them to be used as test points for in-circuit testing.
Bead probe technology; Blind via; Board-to-board connector; Boundary scan; ... Hot air solder leveling; I. Immersion silver plating; In-circuit testing; Insertion ...
A test probe is a physical device used to connect electronic test equipment to a device under test (DUT). Test probes range from very simple, robust devices to complex probes that are sophisticated, expensive, and fragile. Specific types include test prods, oscilloscope probes and current probes.
Possible methods of connecting contact pads to a system include soldering, wirebonding, or flip chip mounting. Contact pads are created alongside a chip's functional structure during the photolithography steps of the fabrication process, and afterwards they are tested .
Solder joint dimensions in SMT quickly become much smaller as advances are made toward ultra-fine pitch technology. The reliability of solder joints becomes more of a concern as less and less solder is allowed for each joint. Voiding is a fault commonly associated with solder joints, especially when reflowing a solder paste in the SMT application.
On the chip, there are two bead types for each CpG (or "CG", as per Figure 1) site per locus. Each locus tested is differentiated by different bead types. [1] Both bead types are attached to single-stranded 50-mer DNA oligonucleotides that differ in sequence only at the free end; this type of probe is known as an allele-specific oligonucleotide ...
Flag at half-staff at National Semiconductor on June 21, 2011. Pease was killed in the crash of his 1969 Volkswagen Beetle, on June 18, 2011. [23] [24] [25] He was leaving a gathering in memory of Jim Williams, who was another well-known analog circuit designer, a technical author, and a renowned staff engineer working at Linear Technology.