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Lead frame for a QFP package, before encapsulation DIP 16 pin Lead frame, after encapsulation and before cutting/separation. The lead frame consists of a central die pad, where the die is placed, surrounded by leads, metal conductors leading away from the die to the outside world. The end of each lead closest to the die ends in a bond pad.
Lead frame of a surface-mount technology package. Most kinds of integrated circuit packaging are made by placing a silicon chip on a lead frame, wire bonding the chip to the metal leads of the lead frame, and covering the chip with plastic. The metal leads protruding from the plastic are then either "cut long" and bent to form through-hole pins ...
Through-hole (leaded) resistors. In electronics, through-hole technology (also spelled "thru-hole") is a manufacturing scheme in which leads on the components are inserted through holes drilled in printed circuit boards (PCB) and soldered to pads on the opposite side, either by manual assembly (hand placement) or by the use of automated insertion mount machines.
Electroplating (plates the copper leads of the lead frames with tin to make soldering easier) Laser marking or silkscreen printing; Trim and form (separates the lead frames from each other, and bends the lead frame's pins so that they can be mounted on a printed circuit board) IC testing; Additionally steps such as Wright etch may be carried out.
The TO-220 is a style of electronic package used for high-powered, through-hole components with 0.1 inches (2.54 mm) pin spacing. The "TO" designation stands for "transistor outline". [2] TO-220 packages have three leads. Similar packages with two, four, five or seven leads are also manufactured.
According to IPC's standard J-STD-012, Implementation of Flip Chip and Chip Scale Technology, in order to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die and it must be a single-die, direct surface mountable package. Another criterion that is often applied to qualify these packages as CSPs is their ...
The European Restriction of Hazardous Substances Directive (RoHS), which took effect on July 1, 2006, restricted the use of lead in various types of electronic and electrical equipment. This has driven the use of lead-free alloys with a focus on preventing whisker formation (see § Mitigation and elimination). Others have focused on the ...
The first devices measured 1/4 inch by 1/8 inch (3.2 mm by 6.4 mm) and had 10 leads. [1] The flat package was smaller and lighter than the round TO-5 style transistor packages previously used for integrated circuits. Round packages were limited to 10 leads. Integrated circuits needed more leads to take full advantage of increasing device density.